Electromigration studies of flip chip Sn95/Sb5 solder bumps on Cr/Cr-Cu/Cu under-bump metallization

T. L. Shao, K. C. Lin, Chih Chen*

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

9 Scopus citations

Abstract

The electromigration-induced failure of Sn95/Sb5 flip chip solder bumps was investigated. The failure of the joints was found at the cathode/chip side after current stressing with a density of 1 × 104 A/cm2 at 150°C for 13 sec. The growth of intermetallic compounds (IMCs) was observed at the anode side after current stressing. Voids were found near the current crowding area in the cathode/chip side, and the (Cu,Ni)6Sn5 IMC at the cathode/chip end was transformed into the Sn phase. The failure mechanism for Sn95/Sb5 flip chip solder joint is proposed in this paper.

Original languageEnglish
Pages (from-to)1278-1283
Number of pages6
JournalJournal of Electronic Materials
Volume32
Issue number11
DOIs
StatePublished - 1 Jan 2003

Keywords

  • Electromigration
  • Failure
  • Flip chip
  • Intermetalic compound
  • Lead-free solder
  • Sn95/Sb5

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