Electromigration interconnect lifetime under AC and pulse DC stress

B. K. Liew*, N. W. Cheung, Chen-Ming Hu

*Corresponding author for this work

Research output: Contribution to conferencePaperpeer-review

55 Scopus citations

Abstract

A vacancy relaxation model which predicts the DC lifetime, pulse DC lifetime, and AC lifetime for all waveforms and all frequencies above 10 kHz is proposed. The AC lifetimes of aluminum interconnect are experimentally found to be more than 103 times larger than DC lifetime at the same current density. AC stress lifetimes have the same dependences on current magnitude and temperature, for T ≤300°C, as the DC stress lifetime.

Original languageEnglish
Pages215-219
Number of pages5
StatePublished - 1 Dec 1989
Event27th Annual Proceedings: Reliability Physics - 1989 -
Duration: 11 Apr 198911 Apr 1989

Conference

Conference27th Annual Proceedings: Reliability Physics - 1989
Period11/04/8911/04/89

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