Electromigration-induced microstructure evolution in tin studied by synchrotron x-ray microdiffraction

Albert T. Wu*, King-Ning Tu, J. R. Lloyd, N. Tamura, B. C. Valek, C. R. Kao

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

58 Scopus citations

Abstract

A grain-by-grain analysis of the microstructural evolution in Sn stripe under electromigration using synchrotron-based white beam x-ray microdiffraction was investigated. Grain-by-grain analysis was obtained from the diffracted Laue patterns about the changes of grain orientation before and after electromigration. It was observed that high-resistance grains reorient with respect to the neighboring low-resistance grains. A different mechanism of grain growth under electromigration from the normal grain growth was also proposed and discussed.

Original languageEnglish
Pages (from-to)2490-2492
Number of pages3
JournalApplied Physics Letters
Volume85
Issue number13
DOIs
StatePublished - 27 Sep 2004

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