Electromigration in Sn-Pb solder strips as a function of alloy composition

C. Y. Liu*, Chih Chen, King-Ning Tu

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

143 Scopus citations

Abstract

Using thin film solder strips, we have investigated the electromigration of six different compositions of Sn-Pb solders at current density of 105 A/cm2 near ambient temperature. The six compositions are pure Sn, Sn80Pb20, Sn70Pb30, Sn62Pb38 (eutectic), Sn40Pb60, and Sn5Pb95. The eutectic alloy, with the lowest melting point and a high density of lamella interfaces, was found to have the fastest hillock growth. As composition moving toward the two terminal phases, the hillock growth rate decreases; but it increases again in pure Sn. The interface between Sn and Pb, being the fastest kinetic path of mass transport, also serves as the place to initiate hillock and void formation.

Original languageEnglish
Pages (from-to)5703-5709
Number of pages7
JournalJournal of Applied Physics
Volume88
Issue number10
DOIs
StatePublished - 15 Nov 2000

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