Electromigration in Pb-free Sn Ag3.8 Cu0.7 solder stripes

Ying Chao Hsu, Chung Kwuang Chou, P. C. Liu, Chih Chen*, D. J. Yao, T. Chou, King-Ning Tu

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

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Electromigration behavior in the eutectic Sn Ag3.8 Cu0.7 solder stripes was investigated in the vicinity of the device operation temperature of 100 °C by using the edge displacement technique. Measurements were made for relevant parameters for electromigration of the solder, such as drift velocity, threshold current density, activation energy, as well as the product of diffusivity and effective charge number (D Z*). The threshold current densities were estimated to be 4.3× 104 A cm2 at 80 °C, 3.2× 104 A cm2 at 100 °C, and 1.4× 104 A cm2 at 120 °C. These values represent the maximum current densities that the Sn Ag3.8 Cu0.7 solder can carry without electromigration damage at the three stressing temperatures. The electromigration activation energy was determined to be 0.45 eV in the temperature range of 80-120 °C. The measured products of diffusivity and the effective charge number, D Z*, were -1.8× 10-10 cm2 s at 80 °C, -5.0× 10-10 cm2 s at 100 °C, and -7.2× 10-10 cm2 s at 120 °C.

Original languageEnglish
Article number033523
JournalJournal of Applied Physics
Issue number3
StatePublished - 1 Aug 2005

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