Electromigration in flip chip solder joints having a thick Cu column bump and a shallow solder interconnect

Jae Woong Nah*, J. O. Suh, King-Ning Tu, Seung Wook Yoon, Vempati Srinivasa Rao, Vaidyanathan Kripesh, Fay Hua

*Corresponding author for this work

Research output: Contribution to journalArticle

94 Scopus citations

Fingerprint Dive into the research topics of 'Electromigration in flip chip solder joints having a thick Cu column bump and a shallow solder interconnect'. Together they form a unique fingerprint.

Physics & Astronomy