Electromigration in flip-chip solder joints

Chen Chih*

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

With the portable devices becoming smaller and more compact in size, flip-chip technology has been adopted for fine-pitch packaging in microelectronics industry. Area array of tiny solder joints can be fabricated on Si chips to achieve high-density packaging. In addition, as the required performance continues to increase, the input/output (I/O) pin count of flip-chip products has dramatically increased and the current that each bump needs to carry continues to increase, resulting in higher current density flowing in each solder bump. Therefore, electromigration (EM) has become an important reliability issue in solder joints. It has been reported that serious current crowding and Joule heating are responsible for the failure mechanism. In this talk, role of current crowding and Joule heating on void formation and propagation will be presented. Furthermore, the methods for relieving current crowding and Joule heating will be discussed to prolong electromigration lifetime

Original languageEnglish
Title of host publicationICSICT-2006
Subtitle of host publication2006 8th International Conference on Solid-State and Integrated Circuit Technology, Proceedings
PublisherIEEE Computer Society
Pages2121-2124
Number of pages4
ISBN (Print)1424401615, 9781424401611
DOIs
StatePublished - 1 Jan 2006
EventICSICT-2006: 2006 8th International Conference on Solid-State and Integrated Circuit Technology - Shanghai, China
Duration: 23 Oct 200626 Oct 2006

Publication series

NameICSICT-2006: 2006 8th International Conference on Solid-State and Integrated Circuit Technology, Proceedings

Conference

ConferenceICSICT-2006: 2006 8th International Conference on Solid-State and Integrated Circuit Technology
CountryChina
CityShanghai
Period23/10/0626/10/06

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