Electromigration in Flip Chip Solder Joints

King Ning Tu*

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingChapter


In 1998, Brandenburg and Yeh reported electromigration failure in fiip chip eutectic SnPb solder joints [1]. Using a current density of 8 × 103 A/cm2 at 150°C for about 100 hr, they detected failure by the formation of a pancake type of void across the entire cathode contact to the Si chip. In addition, a significant amount of phase separation in the bulk of the eutectic solder bump was observed; the Pb has moved to the anode side and the Sn to the cathode side.

Original languageEnglish
Title of host publicationSpringer Series in Materials Science
PublisherSpringer Verlag
Number of pages44
StatePublished - 1 Jan 2007

Publication series

NameSpringer Series in Materials Science
ISSN (Print)0933-033X
ISSN (Electronic)2196-2812


  • Back Stress
  • Composite Solder Joint
  • Current Crowding
  • Solder Bump
  • Solder Joint

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