Electromigration in Flip Chip Solder Joints

King Ning Tu*

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingChapter

Abstract

In 1998, Brandenburg and Yeh reported electromigration failure in fiip chip eutectic SnPb solder joints [1]. Using a current density of 8 × 103 A/cm2 at 150°C for about 100 hr, they detected failure by the formation of a pancake type of void across the entire cathode contact to the Si chip. In addition, a significant amount of phase separation in the bulk of the eutectic solder bump was observed; the Pb has moved to the anode side and the Sn to the cathode side.

Original languageEnglish
Title of host publicationSpringer Series in Materials Science
PublisherSpringer Verlag
Pages245-288
Number of pages44
DOIs
StatePublished - 1 Jan 2007

Publication series

NameSpringer Series in Materials Science
Volume117
ISSN (Print)0933-033X
ISSN (Electronic)2196-2812

Keywords

  • Back Stress
  • Composite Solder Joint
  • Current Crowding
  • Solder Bump
  • Solder Joint

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