Electromigration in flip chip solder joints

King-Ning Tu*, M. Y. Yan, F. Ren, J. Huang, E. Ou, L. Y. Zhang, J. W. Nah

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Scopus citations

Abstract

Electromigration in flip chip solder joints has become a reliability issue in packaging technology because it can occur with a low current density, as low as 1×10 3 A/cm 2 . The cathode and anode interfaces of a solder joint are the places of vacancy flux divergence and the sites of failure due to void formation. Current crowding occurs at the cathode interface where electrons flow into the solder bump, and it induces a unique failure mode of pancake-type void growth across the contact interface. The use of thick Cu UBM has removed the issue of current crowding, but the joint has only a very thin layer of solder which can be converted completely into intermetallic compound. In a very thin solder joint, the effect of electromigration induced back stress is overwhelmed by the chemical reaction at the interfaces.

Original languageEnglish
Title of host publicationSTRESS-INDUCED PHENOMENA IN METALLIZATION
Subtitle of host publicationEighth International Workshop on Stress-Induced Phenomena in Metallization
Pages327-338
Number of pages12
DOIs
StatePublished - 7 Feb 2006
Event8th International Workshop on Stress-Induced Phenomena in Metallization - Dresden, Germany
Duration: 12 Sep 200514 Sep 2005

Publication series

NameAIP Conference Proceedings
Volume817
ISSN (Print)0094-243X
ISSN (Electronic)1551-7616

Conference

Conference8th International Workshop on Stress-Induced Phenomena in Metallization
CountryGermany
CityDresden
Period12/09/0514/09/05

Keywords

  • Electromigration
  • Flip-chip
  • Solder
  • Vacancy flux
  • Voids

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  • Cite this

    Tu, K-N., Yan, M. Y., Ren, F., Huang, J., Ou, E., Zhang, L. Y., & Nah, J. W. (2006). Electromigration in flip chip solder joints. In STRESS-INDUCED PHENOMENA IN METALLIZATION: Eighth International Workshop on Stress-Induced Phenomena in Metallization (pp. 327-338). (AIP Conference Proceedings; Vol. 817). https://doi.org/10.1063/1.2173566