Electromigration in eutectic tin-lead solder lines at the device temperature

Rajat Agarwal*, King-Ning Tu

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Scopus citations

Abstract

Electromigration in eutectic SnPb has been studied at the device temperature i.e. 100°C and at three different current densities viz. 5×103 A/cm2, 3×104 A/cm2 and 5×104 A/cm2. The test samples are prepared by reflowing solder into V-grooves etched on (001) Si wafer. The accumulation of a large lump of solder is observed at the anode for 3×104 A/cm2 and 5×104 A/cm2 current densities. The dominant diffusing species is found to be Pb in both cases. At 5×103 A/cm2, the electromigration doesn't occur. The effects of current stressing on microstructure of eutectic SnPb solder have also been reported. Grain coarsening is observed, which becomes very significant with increasing current density.

Original languageEnglish
Title of host publicationProceedings - 2005 10th International Symposium on Advanced Packaging Materials
Subtitle of host publicationProcesses, Properties and Interfaces
Pages160-163
Number of pages4
DOIs
StatePublished - 1 Dec 2005
Event2005 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces - Irvine, CA, United States
Duration: 16 Mar 200518 Mar 2005

Publication series

NameProceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces
Volume2005

Conference

Conference2005 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces
CountryUnited States
CityIrvine, CA
Period16/03/0518/03/05

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    Agarwal, R., & Tu, K-N. (2005). Electromigration in eutectic tin-lead solder lines at the device temperature. In Proceedings - 2005 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces (pp. 160-163). [1432069] (Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces; Vol. 2005). https://doi.org/10.1109/ISAPM.2005.1432069