@inproceedings{7888a47de0404973bd71b37249a8b481,
title = "Electromigration in 2 mu m Redistribution Lines and Cu-Cu Bonds with Highly -oriented Nanotwinned Cu",
abstract = "In this paper, we adopted highly -oriented nanotwinned Cu (nt-Cu) to fabricate 2-mu m-wide redistribution lines (RDLs) capped with polyimide and 30-um Cu-Cu direct bonds, and then measured their electromigration (EM) lifetimes. The results show that the nt-Cu RDLs possessed a higher EM lifetime than regular Cu RDL lines. Serious oxidation was observed in the Cu lines after the EM tests. For the EM in Cu-Cu bonds, the resistance Cu-Cu bumps increased less than 5% after 1000 h under 2x10(5) A/cm(2) at 150 degrees C.",
keywords = "MAXIMUM STRENGTH, RELIABILITY",
author = "Tseng, {I. Hsin} and Shie, {Kai Cheng} and Lin, {Benson Tzu-Hung} and Chang, {Chia Cheng} and Chih Chen",
year = "2020",
month = aug,
day = "5",
doi = "10.1109/ECTC32862.2020.00083",
language = "English",
isbn = "978-1-7281-6181-5",
series = "Electronic Components and Technology Conference",
publisher = "IEEE COMPUTER SOC",
pages = "479--484",
booktitle = "2020 IEEE 70TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2020)",
note = "null ; Conference date: 03-06-2020 Through 30-06-2020",
}