Electromigration immortality of purely intermetallic micro -bump for 3D integration

Hsiao Yun Chen, Chih Hang Tung, Yi Li Hsiao, Jyun Lin Wu, Tung Ching Yeh, Larry Liang Chen Lin, Chih Chen, Douglas Cheng Hua Yu

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

13 Scopus citations

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Chemical Compounds

Engineering & Materials Science