Electromigration failure in flip chip solder joints due to rapid dissolution of copper

Y. C. Hu, Y. H. Lin, C. R. Kao*, King-Ning Tu

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

122 Scopus citations

Abstract

An electromigration failure mechanism in flip chip solder joints is reported in this communication. The solder joints failed by a very rapid, asymmetrical, and localized dissolution of the Cu metallization on the cathode side. The average dissolution rate was about 1 μm/min. The dissolved Cu included not only the Cu under bump metallurgy but also the on-chip Cu conducting trace. From the location and geometry of the dissolved Cu, it can be concluded that current crowding plays a critical role in the rapid dissolution. The dissolved Cu atoms were driven to the anode side by electromigration, and a large amount of Cu6Sn5 was formed there.

Original languageEnglish
Pages (from-to)2544-2548
Number of pages5
JournalJournal of Materials Research
Volume18
Issue number11
DOIs
StatePublished - 1 Jan 2003

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