Electromigration and thermomigration in flip chip solder joints

King-Ning Tu, Annie Huang, Fan Yi Ouyang

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Original languageEnglish
Title of host publication2006 International Conference on Electronic Materials and Packaging, EMAP
DOIs
StatePublished - 1 Dec 2006
Event2006 International Conference on Electronic Materials and Packaging, EMAP - Kowloon, China
Duration: 11 Dec 200614 Dec 2006

Publication series

Name2006 International Conference on Electronic Materials and Packaging, EMAP

Conference

Conference2006 International Conference on Electronic Materials and Packaging, EMAP
CountryChina
CityKowloon
Period11/12/0614/12/06

Cite this