Electrical investigation of Cu pumping in through-silicon vias for BEOL reliability in 3D integration

Chuan An Cheng, Ryuichi Sugie, Tomoyuki Uchida, Kou Hua Chen, Chi Tsung Chiu, Kuan-Neng Chen*

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

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Engineering & Materials Science