Electrical characterization of fine-pitch compliant bumps

C. K. Lin, Chih Chen, Shyh Ming Chang, Chao Chyun An, Hsiao Ting Lee, Kuo Shu Kao, Jimmy Tsang, Sheng Shu Yang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The electrical characterization of fine-pitch compliant Au bumps is investigated in this study. Compliant Au bumps of 20 microns pitch were fabricated on a glass substrate for chip-on-glass application. Kelvin probes are fabricated and employed to measure the bump resistance. The resistance ranges from 1.0 to 4.5 ohms, depending on process parameters. Current-carrying capability for these bumps is examined. Electromigration test is performed and it is found that the failure occurs in the wiring Al line on the glass substrate, indicating that the Au bumps have high electromigration resistance. The bump resistance is also measured during thermal cycling from 30 to 110 °C, and the resistance increases less than 50 % after 6 cycles. Aging test is also carried out at 60°C and 40 mA, and the failure time is 561 hours.

Original languageEnglish
Title of host publication10th Electronics Packaging Technology Conference, EPTC 2008
Pages608-612
Number of pages5
DOIs
StatePublished - 1 Dec 2008
Event10th Electronics Packaging Technology Conference, EPTC 2008 - Singapore, Singapore
Duration: 9 Dec 200812 Dec 2008

Publication series

Name10th Electronics Packaging Technology Conference, EPTC 2008

Conference

Conference10th Electronics Packaging Technology Conference, EPTC 2008
CountrySingapore
CitySingapore
Period9/12/0812/12/08

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  • Cite this

    Lin, C. K., Chen, C., Chang, S. M., An, C. C., Lee, H. T., Kao, K. S., Tsang, J., & Yang, S. S. (2008). Electrical characterization of fine-pitch compliant bumps. In 10th Electronics Packaging Technology Conference, EPTC 2008 (pp. 608-612). [4763500] (10th Electronics Packaging Technology Conference, EPTC 2008). https://doi.org/10.1109/EPTC.2008.4763500