Electrical and material stability of Orion™ CVD ultra low-k dielectric film for copper interconnection

Kuo Lung Fang, Bing-Yue Tsui, Chen Chi Yang, Mao Chieh Chen, Shyh Dar Lee, K. Beekmann, T. Wilby, K. Giles, S. Ishaq

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Scopus citations

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Engineering & Materials Science