Effects of rapid thermal annealing on cobalt silicided p+ poly-Si gates fabricated by BF2+ implantation into bilayered CoSi/a-Si films

Wen Koi Lai*, Han Wen Liu, Miin Horng Juang, Huang-Chung Cheng

*Corresponding author for this work

Research output: Contribution to journalArticle

Abstract

The cobalt polycide gate formed by implanting BF2+ ions into the bilayered CoSi/a-Si films and the subsequent rapid thermal anneal has been studied. The resulting gate oxide integrity is characterized with respect to various silicide thicknesses and implantation energies. Significant degradation in gate oxide integrity and flat-band voltage shift were found with increasing suicide thickness and annealing temperature, especially for the thicker CoSi2 films, which is attributable to severe boron penetration. Although a thinner silicide can achieve excellent gate dielectric reliability, it will lead to poor high-temperature thermal stability. Moreover, shallower implantation depth and lower annealing temperature, which sustain less boron penetration, would cause the poly-Si gate depletion effects. Therefore, appropriate conditions, which comprise the CoSi2 thickness, the implantation energy, and the annealing temperature, should be employed to optimize the device performance while retaining the thin dielectric reliability.

Original languageEnglish
Pages (from-to)3993-3996
Number of pages4
JournalJapanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers
Volume38
Issue number7 B
DOIs
StatePublished - 15 Jul 1999

Keywords

  • Boron
  • Cobalt
  • Integrity
  • MOS
  • Penetration
  • RTA

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