Effects of passivation layer on stress relaxation in Cu line structures

Dongwen Gan, Sean Yoon, P. S. Ho, P. Cresta, N. Singh, A. F. Bower, Leu-Jih Perng, S. Shankar

Research output: Chapter in Book/Report/Conference proceedingConference contribution

9 Scopus citations

Abstract

In this study, we investigate the effect of passivation layer on mass transport by measuring stress relaxation in Cu damascene line structures. SiC and SiNx passivation layers are investigated and compared with no passivation to examine the bonding effect on mass transport. The observed stress relaxation behavior is analyzed by a kinetic model considering the contribution to mass transport via various diffusion paths including the passivation interface. Results of this study show a significant effect due to the passivation layer that can be attributed to the interfacial chemistry.

Original languageEnglish
Title of host publicationProceedings of the IEEE 2003 International Interconnect Technology Conference, IITC 2003
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages180-182
Number of pages3
ISBN (Electronic)0780377974, 9780780377974
DOIs
StatePublished - 1 Jan 2003
Event2003 IEEE International Interconnect Technology Conference, IITC 2003 - Burlingame, United States
Duration: 2 Jun 20034 Jun 2003

Publication series

NameProceedings of the IEEE 2003 International Interconnect Technology Conference, IITC 2003

Conference

Conference2003 IEEE International Interconnect Technology Conference, IITC 2003
CountryUnited States
CityBurlingame
Period2/06/034/06/03

Keywords

  • Bonding
  • Chemistry
  • Equations
  • Kinetic theory
  • Passivation
  • Silicon carbide
  • Stress measurement
  • Substrates
  • Thermal stresses
  • X-ray diffraction

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  • Cite this

    Gan, D., Yoon, S., Ho, P. S., Cresta, P., Singh, N., Bower, A. F., Perng, L-J., & Shankar, S. (2003). Effects of passivation layer on stress relaxation in Cu line structures. In Proceedings of the IEEE 2003 International Interconnect Technology Conference, IITC 2003 (pp. 180-182). [1219748] (Proceedings of the IEEE 2003 International Interconnect Technology Conference, IITC 2003). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/IITC.2003.1219748