Effects of bump height and UBM structure on the reliability performance of 60μm-pitch solder micro bump interconections

Yu Wei Huang, Chau Jie Zhan, Yu Min Lin, Jing Ye Juang, Shin Yi Huang, Su Mei Chen, Chia Wen Fan, Ren Shin Cheng, Shu Han Chao, C. K. Lin, Jie An Lin, Chih Chen

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Scopus citations

Abstract

Recently, three dimensional integration circuits technology has received much attention since the demands of functionality and performance in microelectronic packaging for electronic products are rapidly increasing. For high-performance 3D chip stacking, high density interconnections are required. In the current types of interconnects, solder micro bumps have been widely adopted. For fine pitch solder micro bump joints, selections of bump height and UBM structure are the important issues that would show the significant effects on the reliability performances of solder micro bump interconnection. In this study, effects of bump height and UBM structure on the reliability properties of lead-free solder micro interconnections with a pitch of 60μm were discussed. The chip-to-chip test vehicle having more than 4290 solder micro bump interconnections with a bump pitch of 60μm was used in this study. To evaluate the effects of bump height and UBM structure on the reliability performance of micro joints, two groups of solder joint were made. The first group of micro joints had a total bump height of 29μm. In this group, Cu/Sn/Cu joint with a thickness of 7μm/15μm/7um, Cu/Sn/Ni/Cu joint having a thickness of 7μm/15μm/2μm/5μm and Cu/Ni/Sn/Ni/Cu joint with a thickness of 5μm/2μm/15μm/2um/5μm were selected. The second group of micro joints had a total bump height of 24μm. In this group, Cu/Sn/Cu joint having a thickness of 7μm/10μm/7um, Cu/Sn/Ni/Cu joint with a thickness of 7μm/10μm/2μm/5μm and Cu/Ni/Sn/Ni/Cu joint having a thickness of 5μm/2μm/10μm/2um/5μm were chosen. We used the fluxless thermocompression bonding process to form these two groups of micro joints. After bonding process, the chip stack was assembled by capillary-type underfill. Reliability tests of temperature cycling test (TCT), high temperature storage (HTS) and electromigration test (EM) were selected to assess the effect of bump height and UBM structure on the reliability properties of those two groups of solder micro bump interconnections.

Original languageEnglish
Title of host publication2014 International Conference on Electronics Packaging, ICEP 2014
PublisherIEEE Computer Society
Pages612-617
Number of pages6
ISBN (Print)9784904090107
DOIs
StatePublished - 1 Jan 2014
Event2014 International Conference on Electronics Packaging, ICEP 2014 - Toyama, Japan
Duration: 23 Apr 201425 Apr 2014

Publication series

Name2014 International Conference on Electronics Packaging, ICEP 2014

Conference

Conference2014 International Conference on Electronics Packaging, ICEP 2014
CountryJapan
CityToyama
Period23/04/1425/04/14

Keywords

  • electromigration test
  • high temperature storage
  • reliability test
  • solder micro bumps
  • temperature cycling test
  • under bump metallurgy

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    Huang, Y. W., Zhan, C. J., Lin, Y. M., Juang, J. Y., Huang, S. Y., Chen, S. M., Fan, C. W., Cheng, R. S., Chao, S. H., Lin, C. K., Lin, J. A., & Chen, C. (2014). Effects of bump height and UBM structure on the reliability performance of 60μm-pitch solder micro bump interconections. In 2014 International Conference on Electronics Packaging, ICEP 2014 (pp. 612-617). [6826753] (2014 International Conference on Electronics Packaging, ICEP 2014). IEEE Computer Society. https://doi.org/10.1109/ICEP.2014.6826753