Effect of void propagation on bump resistance due to electromigration in flip-chip solder joints using Kelvin structure

Y. W. Chang, T. H. Chiang, Chih Chen*

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

32 Scopus citations

Abstract

Three-dimensional modeling is employed to simulate various Kelvin structures for detecting the change in bump resistance due to void formation and propagation during electromigration in flip-chip solder joints. It is found that the Kelvin structures can sense the highest voltage drop when its voltage probes are placed at the current entrance into the bump on the chip side, and it is thus the most sensitive design to monitor void formation and propagation. When the bump resistance increases 20% of its initial value, the depletion percentage of contact opening ranges from 21.0% to 65.0%, depending on the position of the probes.

Original languageEnglish
Article number132113
JournalApplied Physics Letters
Volume91
Issue number13
DOIs
StatePublished - 5 Oct 2007

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