Effect of Thermal Management on the Performance of VCSELs

Po Chou Pan, Dhiman Nag, Zuhaib Khan, Ching Jung Chen, Jin Wei Shi, Apurba Laha, Ray Hua Horng*

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

3 Scopus citations

Abstract

This study investigated the effect of thermal management on the performance of vertical-cavity surface-emitting lasers (VCSELs). It was found that the thickness of silicon substrate, which can serve as the submount for VCSEL packages, has a strong influence on the thermal dissipation of on-chip laser sources, and eventually impacts on their output characteristics. Moreover, the improvements in optical characteristics of the on-chip VCSELs were the best heat dissipation through thinning silicon substrates to 50-mu m thickness combined with electroplated Cu with 100-mu m thickness. In addition, this study also performed COMSOL simulations. The simulation results were consistent with experimental results.

Original languageEnglish
Article number9145606
Pages (from-to)3736-3739
Number of pages4
JournalIEEE Transactions on Electron Devices
Volume67
Issue number9
DOIs
StatePublished - Sep 2020

Keywords

  • COMSOL simulations
  • heat dissipation
  • thermal management
  • vertical-cavity surface-emitting lasers (VCSELs)

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