@inproceedings{199106e5cb36493cb5d1d27f163aed19,
title = "Effect of Sn grain orientation on the formation of Cu6S5 intermetallic compounds during electromigration",
abstract = "Sn grain orientation that has highly anisotropic diffusivities plays a very important role on thermal-cycling test and electromigration failure. In this study, Cu/Sn-2.3Ag/Cu microbumps, assembled by thermal-compression bonding, after electromigration test are investigated grain orientation by electron-backscattering diffraction (EBSD). The condition of electromigration test is under the current density of 4×104 A/cm2 and 165°C. In the results, The IMC growth at the interface of Cu/solder is very serious as the electron flow along a low α-angle grain as very opposed to that along a high α-angle grain. Therefore, we demonstrate IMC formations depend on the angle between c-axis and electron flow in Sn grains.",
author = "Shen, {Yu An} and Chih Chen",
year = "2016",
month = dec,
day = "27",
doi = "10.1109/IMPACT.2016.7800040",
language = "English",
series = "Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT",
publisher = "IEEE Computer Society",
pages = "85--86",
booktitle = "11th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2016 - Proceedings",
address = "United States",
note = "null ; Conference date: 26-10-2016 Through 28-10-2016",
}