Effect of Sn grain orientation on the formation of Cu6S5 intermetallic compounds during electromigration

Yu An Shen, Chih Chen*

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

1 Scopus citations

Abstract

Sn grain orientation that has highly anisotropic diffusivities plays a very important role on thermal-cycling test and electromigration failure. In this study, Cu/Sn-2.3Ag/Cu microbumps, assembled by thermal-compression bonding, after electromigration test are investigated grain orientation by electron-backscattering diffraction (EBSD). The condition of electromigration test is under the current density of 4×104 A/cm2 and 165°C. In the results, The IMC growth at the interface of Cu/solder is very serious as the electron flow along a low α-angle grain as very opposed to that along a high α-angle grain. Therefore, we demonstrate IMC formations depend on the angle between c-axis and electron flow in Sn grains.

Original languageEnglish
Title of host publication11th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2016 - Proceedings
PublisherIEEE Computer Society
Pages85-86
Number of pages2
ISBN (Electronic)9781509047697
DOIs
StatePublished - 27 Dec 2016
Event11th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2016 - Taipei, Taiwan
Duration: 26 Oct 201628 Oct 2016

Publication series

NameProceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT
ISSN (Print)2150-5934
ISSN (Electronic)2150-5942

Conference

Conference11th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2016
CountryTaiwan
CityTaipei
Period26/10/1628/10/16

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