Effect of Sn grain orientation on growth of Cu-Sn intermetallic compounds during thermomigration in Cu-Sn2.3Ag-Ni microbumps

Yu An Shen; Fan Yi Ouyang; Chih Chen

doi:10.1016/j.matlet.2018.10.112

Effect of Sn grain orientation on growth of Cu-Sn intermetallic compounds during thermomigration in Cu-Sn2.3Ag-Ni microbumps

Yu An Shen, Fan Yi Ouyang, Chih Chen^*

^*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

12 Scopus citations

Abstract

The effect of Sn orientation on thermomigration was investigated in Cu/Sn2.3Ag/Ni microbumps with diameter of 20 μm. Results showed that anisotropic diffusion of Cu in Sn grains affected both formation rates and locations of Cu₆Sn₅ intermetallic compounds (IMCs). Rapid growth of Cu₆Sn₅ IMCs at the cold-end interface was observed when the c-axis of Sn grains was parallel to the temperature gradient. In addition, diffusion of Cu atoms was blocked by a Sn grain with a high angle between the Sn c-axis and the thermal gradient, resulting in formation of Cu₆Sn₅ IMCs near the grain boundary inside the solder.

Original language	English
Pages (from-to)	190-193
Number of pages	4
Journal	Materials Letters
Volume	236
DOIs	https://doi.org/10.1016/j.matlet.2018.10.112
State	Published - 1 Feb 2019

Keywords

Diffusion
Grain boundary
Grain orientation
Intermetallic compounds
Thermomigration

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@article{897d46cb6e734fda909c6c9215fc9cb8,

title = "Effect of Sn grain orientation on growth of Cu-Sn intermetallic compounds during thermomigration in Cu-Sn2.3Ag-Ni microbumps",

abstract = "The effect of Sn orientation on thermomigration was investigated in Cu/Sn2.3Ag/Ni microbumps with diameter of 20 μm. Results showed that anisotropic diffusion of Cu in Sn grains affected both formation rates and locations of Cu6Sn5 intermetallic compounds (IMCs). Rapid growth of Cu6Sn5 IMCs at the cold-end interface was observed when the c-axis of Sn grains was parallel to the temperature gradient. In addition, diffusion of Cu atoms was blocked by a Sn grain with a high angle between the Sn c-axis and the thermal gradient, resulting in formation of Cu6Sn5 IMCs near the grain boundary inside the solder.",

keywords = "Diffusion, Grain boundary, Grain orientation, Intermetallic compounds, Thermomigration",

author = "Shen, {Yu An} and Ouyang, {Fan Yi} and Chih Chen",

year = "2019",

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journal = "Materials Letters",

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T1 - Effect of Sn grain orientation on growth of Cu-Sn intermetallic compounds during thermomigration in Cu-Sn2.3Ag-Ni microbumps

AU - Shen, Yu An

AU - Ouyang, Fan Yi

AU - Chen, Chih

PY - 2019/2/1

Y1 - 2019/2/1

N2 - The effect of Sn orientation on thermomigration was investigated in Cu/Sn2.3Ag/Ni microbumps with diameter of 20 μm. Results showed that anisotropic diffusion of Cu in Sn grains affected both formation rates and locations of Cu6Sn5 intermetallic compounds (IMCs). Rapid growth of Cu6Sn5 IMCs at the cold-end interface was observed when the c-axis of Sn grains was parallel to the temperature gradient. In addition, diffusion of Cu atoms was blocked by a Sn grain with a high angle between the Sn c-axis and the thermal gradient, resulting in formation of Cu6Sn5 IMCs near the grain boundary inside the solder.

AB - The effect of Sn orientation on thermomigration was investigated in Cu/Sn2.3Ag/Ni microbumps with diameter of 20 μm. Results showed that anisotropic diffusion of Cu in Sn grains affected both formation rates and locations of Cu6Sn5 intermetallic compounds (IMCs). Rapid growth of Cu6Sn5 IMCs at the cold-end interface was observed when the c-axis of Sn grains was parallel to the temperature gradient. In addition, diffusion of Cu atoms was blocked by a Sn grain with a high angle between the Sn c-axis and the thermal gradient, resulting in formation of Cu6Sn5 IMCs near the grain boundary inside the solder.

KW - Diffusion

KW - Grain boundary

KW - Grain orientation

KW - Intermetallic compounds

KW - Thermomigration

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DO - 10.1016/j.matlet.2018.10.112

M3 - Article

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VL - 236

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EP - 193

JO - Materials Letters

JF - Materials Letters

SN - 0167-577X

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