Effect of Sn grain orientation on formation of Cu6Sn5 intermetallic compounds during electromigration

Yu An Shen, Chih Chen*

*Corresponding author for this work

Research output: Contribution to journalArticle

30 Scopus citations

Abstract

The effects of Sn orientation and grain boundary misorientation on formation of Cu-Sn intermetallic compounds (IMCs) during electromigration were investigated. Significant anisotropic diffusion of Cu in Sn grains was observed. Interfacial Cu-Sn IMCs may grow rapidly, dissolve, or remain intact, depending on the angle of c-axis of Sn grains with the electron flow. In addition, grain boundaries did not play an important role in Cu diffusion because they are mostly cyclic twins.

Original languageEnglish
Pages (from-to)6-9
Number of pages4
JournalScripta Materialia
Volume128
DOIs
StatePublished - 1 Feb 2017

Keywords

  • Anisotropic diffusion
  • Electromigration
  • Grain orientation
  • Intermetallic compounds

Fingerprint Dive into the research topics of 'Effect of Sn grain orientation on formation of Cu<sub>6</sub>Sn<sub>5</sub> intermetallic compounds during electromigration'. Together they form a unique fingerprint.

  • Cite this