Effect of Sn Grain Orientation on Formation of Cu6Sn5 Intermetallic Compound Under Current Stressing

Ming Yao Chen, Han wen Lin, Chih Chen*

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

2 Scopus citations

Abstract

Solder joints with Cu/Sn-Ag/Cu structure and bump height of 15 μm have been used to investigate the electromigration phenomenon at different temperatures and current densities. Moreover, the grain orientation was analyzed using electron backscatter diffraction. It was found that the anisotropic properties of tin affected the formation rate of Cu-Sn intermetallic compounds (IMCs), and that the angle between the electron flow direction and tin grain orientation played an important role in the formation of Cu6Sn5 IMC. With changes in angle, the diffusion rate of copper atoms in tin also varied. When the c-axis of tin was parallel to the electron flux, copper atoms diffused rapidly, resulting in fast formation of Cu-Sn IMCs. On the other hand, if the angle between the c-axis of the grain and the electron flow direction was large, the tin grains were more resistant to Cu diffusion during current stressing, leading to a very slow IMC formation rate.

Original languageEnglish
Pages (from-to)2179-2184
Number of pages6
JournalJournal of Electronic Materials
Volume46
Issue number4
DOIs
StatePublished - 1 Apr 2017

Keywords

  • Electromigration
  • intermetallic compounds
  • preferred orientation
  • solder joints

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