Effect of passivation opening design on electromigration reliability issue in flip-chip solder joints

Tzu Yu Chen, S. W. Liang, Chih Chen*

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This study investigates the effect of passivation opening design on electromigration reliability issue in flip-chip solder joints by using statistical analysis. Eutectic SnAg solder joints were used in this study with two different filling condition of polyimide (PI), ie with or without contact opening. The bump height is 50 μm. The four point probe method was used to monitor the bump resistance of a specific solder joint with downward election flow, under 0.8 A at 155°C. The failure criteria are defined as the resistances rose to 1.2 times and 2 times of their initial values. In addition, three-dimensional finite element analysis (3D-FEA) was employed to show the distribution of current density, and the different failure modes were also discussed. The solder joints without PI performed longer failure time from the statistical analysis results. In other words, the set without PI shows better reliability than that with PI.

Original languageEnglish
Title of host publicationIMPACT Conference 2009 International 3D IC Conference - Proceedings
Pages267-270
Number of pages4
DOIs
StatePublished - 1 Dec 2009
EventIMPACT Conference 2009 International 3D IC Conference - Taipei, Taiwan
Duration: 21 Oct 200923 Oct 2009

Publication series

NameIMPACT Conference 2009 International 3D IC Conference - Proceedings

Conference

ConferenceIMPACT Conference 2009 International 3D IC Conference
CountryTaiwan
CityTaipei
Period21/10/0923/10/09

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  • Cite this

    Chen, T. Y., Liang, S. W., & Chen, C. (2009). Effect of passivation opening design on electromigration reliability issue in flip-chip solder joints. In IMPACT Conference 2009 International 3D IC Conference - Proceedings (pp. 267-270). [5382121] (IMPACT Conference 2009 International 3D IC Conference - Proceedings). https://doi.org/10.1109/IMPACT.2009.5382121