Effect of electromigration on mechanical behavior of solder joints

Fei Ren*, Jae Woong Nah, Hua Gan, Jong Ook Suh, King-Ning Tu, Bingshou Xiong, Luhua Xu, John Pang

*Corresponding author for this work

Research output: Contribution to journalConference articlepeer-review

4 Scopus citations

Abstract

Electromigration in solder joints causes a void formation between intermetallic compounds (IMC) and solder at the cathode. The effect of electromigration in mechanical test of Cu wires joined by solder was performed. The current density of electromigration was l∼5 × 10 3 A/cm 2. The working temperature was 100 ∼150°C. Tensile stress and shear stress were applied either before or after electromigration. The tensile strain rate was 3 um/min. We observed that, without electromigration, tensile stress caused a ductile break at the middle of solders because the solder was softer. On the other hand, if combined with electromigration, a brittle failure always occurred at the cathodes interface during tensile test. The ultimate tensile strength decreased with longer electromigration time or higher current density. In shear test, the daisy chain of solders failed alternatively at the cathodes after electromigration.

Original languageEnglish
Article numberB10.2
Pages (from-to)369-373
Number of pages5
JournalMaterials Research Society Symposium Proceedings
Volume863
StatePublished - 19 Dec 2005
Event2005 Materials Research Society Spring Meeting - San Francisco, CA, United States
Duration: 28 Mar 20051 Apr 2005

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