Effect of electromigration-induced back stress gradient on nanoindentation marker movement in SnAgCu solder joints

Luhua Xu*, John H.L. Pang, King-Ning Tu

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

44 Scopus citations

Abstract

The electromigration-induced back stress in Pb-free SnAgCu solder was studied by an area array of nanoindentation markers on the cross section of a solder joint. The marker movements driven by combined electron wind force and electromigration-induced back stress gradient were measured at different locations. The back stress gradient was determined from the observation of marker motion using the proposed model. With the applied current density of 104 A cm2 at 125 °C, the stress gradient near the anode is 97 kPaμm.

Original languageEnglish
Article number221909
JournalApplied Physics Letters
Volume89
Issue number22
DOIs
StatePublished - 7 Dec 2006

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