Effect of electromigration in the anodic Al interconnect on melting of flip chip solder joints

Fan Yi Ouyang; King-Ning Tu; Chin Li Kao; Yi Shao Lai

doi:10.1063/1.2743395

Effect of electromigration in the anodic Al interconnect on melting of flip chip solder joints

Fan Yi Ouyang^*, King-Ning Tu, Chin Li Kao, Yi Shao Lai

^*Corresponding author for this work

International College of Semiconductor Technology

Research output: Contribution to journal › Article

21 Scopus citations

Abstract

Melting of eutectic SnPb flip chip solder joints has been observed to occur frequently in dc electromigration tested with current density above 1.5× 104 A cm2 at an ambient temperature of 100 °C. It has been found that it is not due to the Joule heating of the solder bump itself, but rather due to the Joule heating of the on-chip Al interconnects. The current density in the Al approaches 2× 106 A cm2 and electromigration has especially generated voids at the anode of the Al. The damage has greatly increased the resistance of the Al, which produces the heat needed to melt the solder joint. The results of electrothermal coupling analysis show that when the resistance of the Al line changed threefold, the solder bump melted.

Original language	English
Article number	211914
Journal	Applied Physics Letters
Volume	90
Issue number	21
DOIs	https://doi.org/10.1063/1.2743395
State	Published - 1 Jun 2007

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Ouyang, F. Y., Tu, K-N., Kao, C. L., & Lai, Y. S. (2007). Effect of electromigration in the anodic Al interconnect on melting of flip chip solder joints. Applied Physics Letters, 90(21), [211914]. https://doi.org/10.1063/1.2743395

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