Abstract
Large-area (1000×1000 μm2) p-side down InGaN light-emitting diodes (LEDs) have been fabricated by laser lift-off (LLO) technique. The p-side down LEDs with different geometric patterns of n-electrode were fabricated to investigate electrode pattern-dependent optical characteristics. Current crowding effect was first observed in in the p-side down InGaN LLO-LEDs. The LEDs with well designed n-electrode shows a uniform distribution of light-emitting pattern and higher out put power due to uniform current spreading and minimization of thermal effect. The output power saturation induced by current crowding in the LEDs with simplest geometric n-electrode was demonstrated. In absent of transparent contact layer for current spreading, the n-electrode pattern has remarkable influence on the current distribution and consequently the light output power of the large-area p-side down LEDs.
Original language | English |
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Article number | 20 |
Pages (from-to) | 122-128 |
Number of pages | 7 |
Journal | Progress in Biomedical Optics and Imaging - Proceedings of SPIE |
Volume | 5739 |
DOIs | |
State | Published - 21 Jul 2005 |
Event | Light-Emitting Diodes: Research, Manufacturing, and Applications IX - San Jose, CA, United States Duration: 25 Jan 2005 → 27 Jan 2005 |
Keywords
- GaN LEDs
- Large-area light-emitting LEDs
- Laser lift-off (LLO)
- Wafer bonding