Effect of Al-trace dimension on Joule heating and current crowding in flip-chip solder joints under accelerated electromigration

S. W. Liang, Y. W. Chang, Chih Chen*

*Corresponding author for this work

Research output: Contribution to journalArticle

48 Scopus citations

Abstract

Three-dimensional thermoelectrical simulation was conducted to investigate the influence of Al-trace dimension on Joule heating and current crowding in flip-chip solder joints. It is found that the dimension of the Al-trace effects significantly on the Joule heating, and thus directly determines the mean time to failure (MTTF). Simulated at a stressing current of 0.6 A at 70 °C, we estimate that the MTTF of the joints with Al traces in 100 μm width was 6.1 times longer than that of joints with Al traces in 34 μm width. Lower current crowding effect and reduced hot-spot temperature are responsible for the improved MTTF.

Original languageEnglish
Article number172108
JournalApplied Physics Letters
Volume88
Issue number17
DOIs
StatePublished - 15 May 2006

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