Effect of additives on the microstructures of highly-oriented (111) nanotwinned Cu

Kuan-Ju Chen*, Chih Chen, Zong-Cyuan Chen, Stream Chung, Chiu-Ming Hung

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Copper is the common materials for the semiconductor industry. Especially, electrodeposited copper is the most widely used for its excellent electrical, physical properties and low cost. However, when the dimensions of Cu interconnections have been continuously reduced, severe increases in the electrical resistivity become a serious problem, known as "size effect".[3] Recently, copper with nanotwinned microstructure is widely studied for its excellent mechanical and electrical property. Beside, nt-Cu can trigger anisotropic grain growth to achieve large grains has been reported previously.[1] This may become a candidate for solving size effect problem. Therefore, how to fabricate different microstructure of nt-Cu film[2] and understand the relationship between the nanotwinned microstructure and grain growth behavior are important.
Original languageEnglish
Title of host publication2016 11TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE (IMPACT-IAAC 2016)
PublisherIEEE
Pages314-315
Number of pages2
DOIs
StatePublished - 26 Oct 2016
Event11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT-IAAC) - Taipei
Duration: 26 Oct 201628 Oct 2016

Publication series

NameInternational Microsystems Packaging Assembly and Circuits Technology Conference
PublisherIEEE
ISSN (Print)2150-5934

Conference

Conference11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT-IAAC)
CityTaipei
Period26/10/1628/10/16

Keywords

  • STRESS
  • COPPER
  • GROWTH

Cite this

Chen, K-J., Chen, C., Chen, Z-C., Chung, S., & Hung, C-M. (2016). Effect of additives on the microstructures of highly-oriented (111) nanotwinned Cu. In 2016 11TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE (IMPACT-IAAC 2016) (pp. 314-315). (International Microsystems Packaging Assembly and Circuits Technology Conference). IEEE. https://doi.org/10.1109/IMPACT.2016.7800029