Effect of 0.5 wt% Cu in Sn-3.5%Ag solder balls on the solid state interfacial reaction with Au/Ni/Cu bond pads for Ball Grid Array (BGA) applications

M. O. Alam, Y. C. Chan*, King-Ning Tu, J. K. Kivilahti

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

31 Scopus citations

Abstract

The influence of 0.5 wt % Cu in Sn-3.5% Ag solder balls on the solid state interfacial reaction with trilayer metallization of Au/Ni/Cu bond pads for ball grid array (BGA) applications was analyzed. Microstructures of the solder interface after solid-state aging at each temperature for different times were carefully investigated. Interfacial reactions between the eutectic Sn-3.5%Ag solder and the Ni metallization resulted in the growth of only Ni 3Sn 4 in solid-state reactions. A change in the reaction mechanism was observed with an increase of temperature, during the solid-state reactions.

Original languageEnglish
Pages (from-to)2223-2226
Number of pages4
JournalChemistry of Materials
Volume17
Issue number9
DOIs
StatePublished - 3 May 2005

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