Effect of 0.5 wt% Cu addition in Sn-3.5%Ag solder on the dissolution rate of Cu metallization

M. O. Alam, Y. C. Chan*, King-Ning Tu

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

80 Scopus citations

Abstract

Dissolution behavior of copper (Cu) in the lead-free Sn-3.5%Ag solder was studied with and without predoped Cu. It was found that 0.5 wt% Cu addition reduced the rate of Cu dissolution significantly. A higher Cu content than the solubility was observed by calculating the dissolved weight percentage. The results show that the precipitated intermetallic compounds (IMC) nucleated during the molten condition due to heterogeneous nucleation on the oxide/solder interface and facilitated further dissolution of Cu from the interface.

Original languageEnglish
Pages (from-to)7904-7909
Number of pages6
JournalJournal of Applied Physics
Volume94
Issue number12
DOIs
StatePublished - 15 Dec 2003

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