Easy Process and Performance Improvement for Top-Emission Organic Light-Emitting Diodes by Using UV Glue as the Insulation Layer on Copper Substrate

Yu Sheng Tsai, Shun Hsi Wang, Fuh Shyang Juang, Shu Wei Chang, Chuan hung Chen, Ming Hua Chung, Ming Hua Chung, Tsung-Eong Hsien, Mark O. Liu, Teh Chao Liao

Research output: Contribution to journalArticlepeer-review

7 Scopus citations

Abstract

A high heat dissipation material (copper, Cu) was employed as the substrate for top emission organic light-emitting diodes (TEOLEDs). The UV glue was spin-coated onto the Cu substrate as the insulation layer to effectively improve Cu surface roughness and reduce process complexity. From the optoelectronic results, the optimized device with the Cu substrate shows the maximum luminance of 14110 cd/m2 and luminance efficiency of 7.14 cd/A. The surface and junction temperatures are measured to discuss the heat-dissipating effect on device performance. From the results, TEOLED fabricated on a Cu substrate has lower junction (55.34 °C) and surface (25.7 °C) temperatures, with the lifetime extended seven times. We employed Cu foil as the substrate for flexible TEOLED with maximum luminance of 10310 cd/m2 and luminance efficiency of 7.3 cd/A obtained.

Original languageEnglish
Pages (from-to)279-283
Number of pages5
JournalIEEE/OSA Journal of Display Technology
Volume6
Issue number7
DOIs
StatePublished - 1 Jan 2010

Keywords

  • Heat dissipation
  • junction temperature
  • lifetime
  • luminance efficiency
  • organic light-emitting diode (OLED)
  • UV glue

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