Due-date assignment for wafer fabrication under demand variate environment

W.l. Pearn*, S. H. Chung, C. M. Lai

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

30 Scopus citations

Abstract

In the semiconductor industry, dynamic changes in demand force companies to change the product mix frequently and periodically. Assigning tight but attainable due dates is a great challenge under the circumstances that the product mix changes periodically. In this paper, we consider the due-date assignment problem for wafer fabrication and present a due-date assignment model to set manufacturing due dates satisfying the target on-time-delivery rate. The contamination model is applied to tackle the effect of that product mix varies periodically. We demonstrate the effectiveness and accuracy of the proposed model by solving a real-world example taken from a wafer fabrication shop floor in an IC manufacturing factory.

Original languageEnglish
Pages (from-to)165-175
Number of pages11
JournalIEEE Transactions on Semiconductor Manufacturing
Volume20
Issue number2
DOIs
StatePublished - 1 May 2007

Keywords

  • Contamination model
  • Due-date assignment
  • Flow time
  • Product mix
  • Wafer fabrication

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