Ductile–to-Brittle Transition of Solder Joints Affected by Copper–Tin Reaction and Electromigration

King Ning Tu*

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingChapter

Abstract

Concerning the mechanical properties of solder joints, there are two unique characteristics worth mentioning again and again. The first is that solder alloys have a very high homologous temperature at the device working temperature or at room temperature.

Original languageEnglish
Title of host publicationSpringer Series in Materials Science
PublisherSpringer Verlag
Pages305-326
Number of pages22
DOIs
StatePublished - 1 Jan 2007

Publication series

NameSpringer Series in Materials Science
Volume117
ISSN (Print)0933-033X
ISSN (Electronic)2196-2812

Keywords

  • Charpy Impact Test
  • Drop Test
  • Solder Ball
  • Solder Bump
  • Solder Joint

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  • Cite this

    Tu, K. N. (2007). Ductile–to-Brittle Transition of Solder Joints Affected by Copper–Tin Reaction and Electromigration. In Springer Series in Materials Science (pp. 305-326). (Springer Series in Materials Science; Vol. 117). Springer Verlag. https://doi.org/10.1007/978-0-387-38892-2_11