Dual damascene patterning of polymer interlayer dielectrics

M. Hussein, R. Brain, R. Turkot, Leu-Jih Perng, V. Singh, S. Sivakumar

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

3 Scopus citations

Abstract

We unveil an innovative and manufacturable process technique to pattern dual damascene structures in polymer interlayer dielectric (ILD) without the need for either a permanent hardmask or an embedded etch stop (ES) layer. We introduce a sacrificial hardmask (SAM) and a sacrificial via fill (SAVIL) material to enable the patterning process. Since the hardmask is sacrificial, it is removed at the end of the patterning process without compromising the overall dielectric value of the ILD. The utilization of the SAVIL material provided the trench lithography step with a hole-free, and planar substrate. We demonstrate patterning of dual damascene structures using SAM/SAVIL in a via-first integration scheme through a comparative patterning performance between the SAM/SAVIL-assisted dual damascene patterning and the dual hardmask approach used most in the industry.

Original languageEnglish
Title of host publicationProceedings of the IEEE 2003 International Interconnect Technology Conference, IITC 2003
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages33-35
Number of pages3
ISBN (Electronic)0780377974, 9780780377974
DOIs
StatePublished - 1 Jan 2003
Event2003 IEEE International Interconnect Technology Conference, IITC 2003 - Burlingame, United States
Duration: 2 Jun 20034 Jun 2003

Publication series

NameProceedings of the IEEE 2003 International Interconnect Technology Conference, IITC 2003

Conference

Conference2003 IEEE International Interconnect Technology Conference, IITC 2003
CountryUnited States
CityBurlingame
Period2/06/034/06/03

Keywords

  • Copper
  • Dielectric constant
  • Dielectric materials
  • Etching
  • High K dielectric materials
  • Lithography
  • Logic
  • Manufacturing processes
  • Polymers
  • Simultaneous localization and mapping

Fingerprint Dive into the research topics of 'Dual damascene patterning of polymer interlayer dielectrics'. Together they form a unique fingerprint.

Cite this