Dominant effects of Sn orientation on serrated cathode dissolution and resulting failure in actual solder joints under electromigration

T. L. Yang, J. J. Yu, C. C. Li, Y. F. Lin, C. R. Kao*

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

35 Scopus citations

Abstract

Excessive metal dissolution is one of the major electromigration-induced degradation mechanisms in interconnects, and it often produces a distinctive serrated cathode interface with most of the serrated teeth inclined toward a specific direction. In this study, actual flip-chip solder joints were systematically analyzed to understand this highly interesting morphology. It was unequivocally established that the Sn grain orientation is a dominant factor that controls the direction of the serrated teeth. When the c-axis of a Sn grain was nearly parallel to the electron flow direction, serrated dissolution occurred, with the serrated teeth inclined toward the c-axis. These observations were rationalized based on the diffusion anisotropy of Cu in Sn.

Original languageEnglish
Pages (from-to)281-286
Number of pages6
JournalJournal of Alloys and Compounds
Volume627
DOIs
StatePublished - 5 Apr 2015

Keywords

  • Dissolution
  • Electromigration
  • Grain orientation
  • Solder

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