Distinguished student paper: Effects of localized warpage and stress on chip-on-glass packaging induced light leakage phenomenon in 13-inch tft-lcd

Chin Cheng Chang, Jih-Perng Leu, Mao Hsing Lin, Kun Feng Huang

Research output: Contribution to journalConference article

3 Scopus citations

Abstract

Mura defect induced by chip-on-glass packaging in 13-inch LCD-TFT was investigated using contour measurement and numerical analysis. Excellent correlation between Mura defect and localized warpage/principal stress has been established. Besides, the effects of ACF bonding temperatures and Si chip arrangement on Mura defect were studied and discussed.

Original languageEnglish
Pages (from-to)838-841
Number of pages4
JournalDigest of Technical Papers - SID International Symposium
Volume40
Issue number1
DOIs
StatePublished - 1 Jan 2009
Event2009 Vehicles and Photons Symposium - Dearborn, MI, United States
Duration: 15 Oct 200916 Oct 2009

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