Distinguished student paper: Effects of localized warpage and stress on chip-on-glass packaging induced light leakage phenomenon in 13-inch tft-lcd

Chin Cheng Chang; Jih-Perng Leu; Mao Hsing Lin; Kun Feng Huang

doi:10.1889/1.3256924

Distinguished student paper: Effects of localized warpage and stress on chip-on-glass packaging induced light leakage phenomenon in 13-inch tft-lcd

Chin Cheng Chang, Jih-Perng Leu, Mao Hsing Lin, Kun Feng Huang

Department of Materials Science and Engineering

Research output: Contribution to journal › Conference article

3 Scopus citations

Abstract

Mura defect induced by chip-on-glass packaging in 13-inch LCD-TFT was investigated using contour measurement and numerical analysis. Excellent correlation between Mura defect and localized warpage/principal stress has been established. Besides, the effects of ACF bonding temperatures and Si chip arrangement on Mura defect were studied and discussed.

Original language	English
Pages (from-to)	838-841
Number of pages	4
Journal	Digest of Technical Papers - SID International Symposium
Volume	40
Issue number	1
DOIs	https://doi.org/10.1889/1.3256924
State	Published - 1 Jan 2009
Event	2009 Vehicles and Photons Symposium - Dearborn, MI, United States Duration: 15 Oct 2009 → 16 Oct 2009

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@article{7f11db2765144d70bed1017609f0490d,

title = "Distinguished student paper: Effects of localized warpage and stress on chip-on-glass packaging induced light leakage phenomenon in 13-inch tft-lcd",

abstract = "Mura defect induced by chip-on-glass packaging in 13-inch LCD-TFT was investigated using contour measurement and numerical analysis. Excellent correlation between Mura defect and localized warpage/principal stress has been established. Besides, the effects of ACF bonding temperatures and Si chip arrangement on Mura defect were studied and discussed.",

author = "Chang, {Chin Cheng} and Jih-Perng Leu and Lin, {Mao Hsing} and Huang, {Kun Feng}",

year = "2009",

month = jan,

day = "1",

doi = "10.1889/1.3256924",

language = "English",

volume = "40",

pages = "838--841",

journal = "Digest of Technical Papers - SID International Symposium",

issn = "0097-966X",

number = "1",

note = "null ; Conference date: 15-10-2009 Through 16-10-2009",

}

Distinguished student paper : Effects of localized warpage and stress on chip-on-glass packaging induced light leakage phenomenon in 13-inch tft-lcd. / Chang, Chin Cheng; Leu, Jih-Perng; Lin, Mao Hsing; Huang, Kun Feng.

In: Digest of Technical Papers - SID International Symposium, Vol. 40, No. 1, 01.01.2009, p. 838-841.

Research output: Contribution to journal › Conference article

TY - JOUR

T1 - Distinguished student paper

AU - Chang, Chin Cheng

AU - Leu, Jih-Perng

AU - Lin, Mao Hsing

AU - Huang, Kun Feng

PY - 2009/1/1

Y1 - 2009/1/1

N2 - Mura defect induced by chip-on-glass packaging in 13-inch LCD-TFT was investigated using contour measurement and numerical analysis. Excellent correlation between Mura defect and localized warpage/principal stress has been established. Besides, the effects of ACF bonding temperatures and Si chip arrangement on Mura defect were studied and discussed.

AB - Mura defect induced by chip-on-glass packaging in 13-inch LCD-TFT was investigated using contour measurement and numerical analysis. Excellent correlation between Mura defect and localized warpage/principal stress has been established. Besides, the effects of ACF bonding temperatures and Si chip arrangement on Mura defect were studied and discussed.

UR - http://www.scopus.com/inward/record.url?scp=85054011617&partnerID=8YFLogxK

U2 - 10.1889/1.3256924

DO - 10.1889/1.3256924

M3 - Conference article

AN - SCOPUS:85054011617

VL - 40

SP - 838

EP - 841

JO - Digest of Technical Papers - SID International Symposium

JF - Digest of Technical Papers - SID International Symposium

SN - 0097-966X

IS - 1

Y2 - 15 October 2009 through 16 October 2009

ER -