Direct measurement of hot-spot temperature in flip-chip solder joints with Cu columns under current stressing using infrared microscopy

You Chun Liang; Chih Chen

doi:10.1109/IMPACT.2009.5382153

Direct measurement of hot-spot temperature in flip-chip solder joints with Cu columns under current stressing using infrared microscopy

You Chun Liang, Chih Chen^*

^*Corresponding author for this work

Department of Materials Science and Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

4 Scopus citations

Abstract

In this study, the temperature map distribution in the Sn3.0Ag0.5Cu solder bump with Cu column under current stressing is directly examined using infrared microscopy. It is the radiance changes between the different materials of the surface that cause the unreasonable temperature map distribution. By coating a thin layer of black optical paint which is in order to eliminate the radiance changes, we got the corrected temperature map distribution. Under a current stress of 1.15 × 10⁴ A/cm² at 100°C, the hot-spot temperature is 132.2°C which surpasses the average Cu column temperature of 129.7 °C and the average solder bump temperature of 127.4 °C. It is interesting that there are two modes of temperature distribution in the Cu column and in the solder bump, respectively.

Original language	English
Title of host publication	IMPACT Conference 2009 International 3D IC Conference - Proceedings
Pages	158-161
Number of pages	4
DOIs	https://doi.org/10.1109/IMPACT.2009.5382153
State	Published - 1 Dec 2009
Event	IMPACT Conference 2009 International 3D IC Conference - Taipei, Taiwan Duration: 21 Oct 2009 → 23 Oct 2009

Publication series

Name	IMPACT Conference 2009 International 3D IC Conference - Proceedings

Conference

Conference	IMPACT Conference 2009 International 3D IC Conference
Country	Taiwan
City	Taipei
Period	21/10/09 → 23/10/09

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10.1109/IMPACT.2009.5382153

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Liang, Y. C., & Chen, C. (2009). Direct measurement of hot-spot temperature in flip-chip solder joints with Cu columns under current stressing using infrared microscopy. In IMPACT Conference 2009 International 3D IC Conference - Proceedings (pp. 158-161). [5382153] (IMPACT Conference 2009 International 3D IC Conference - Proceedings). https://doi.org/10.1109/IMPACT.2009.5382153

@inproceedings{b0635a4e486242d4b4aff6cbeb23776e,

title = "Direct measurement of hot-spot temperature in flip-chip solder joints with Cu columns under current stressing using infrared microscopy",

abstract = "In this study, the temperature map distribution in the Sn3.0Ag0.5Cu solder bump with Cu column under current stressing is directly examined using infrared microscopy. It is the radiance changes between the different materials of the surface that cause the unreasonable temperature map distribution. By coating a thin layer of black optical paint which is in order to eliminate the radiance changes, we got the corrected temperature map distribution. Under a current stress of 1.15 × 104 A/cm2 at 100°C, the hot-spot temperature is 132.2°C which surpasses the average Cu column temperature of 129.7 °C and the average solder bump temperature of 127.4 °C. It is interesting that there are two modes of temperature distribution in the Cu column and in the solder bump, respectively.",

author = "Liang, {You Chun} and Chih Chen",

year = "2009",

month = dec,

day = "1",

doi = "10.1109/IMPACT.2009.5382153",

language = "English",

isbn = "9781424443413",

series = "IMPACT Conference 2009 International 3D IC Conference - Proceedings",

pages = "158--161",

booktitle = "IMPACT Conference 2009 International 3D IC Conference - Proceedings",

note = "null ; Conference date: 21-10-2009 Through 23-10-2009",

}

Liang, YC & Chen, C 2009, Direct measurement of hot-spot temperature in flip-chip solder joints with Cu columns under current stressing using infrared microscopy. in IMPACT Conference 2009 International 3D IC Conference - Proceedings., 5382153, IMPACT Conference 2009 International 3D IC Conference - Proceedings, pp. 158-161, IMPACT Conference 2009 International 3D IC Conference, Taipei, Taiwan, 21/10/09. https://doi.org/10.1109/IMPACT.2009.5382153

Direct measurement of hot-spot temperature in flip-chip solder joints with Cu columns under current stressing using infrared microscopy. / Liang, You Chun; Chen, Chih.

IMPACT Conference 2009 International 3D IC Conference - Proceedings. 2009. p. 158-161 5382153 (IMPACT Conference 2009 International 3D IC Conference - Proceedings).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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T1 - Direct measurement of hot-spot temperature in flip-chip solder joints with Cu columns under current stressing using infrared microscopy

AU - Liang, You Chun

AU - Chen, Chih

PY - 2009/12/1

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N2 - In this study, the temperature map distribution in the Sn3.0Ag0.5Cu solder bump with Cu column under current stressing is directly examined using infrared microscopy. It is the radiance changes between the different materials of the surface that cause the unreasonable temperature map distribution. By coating a thin layer of black optical paint which is in order to eliminate the radiance changes, we got the corrected temperature map distribution. Under a current stress of 1.15 × 104 A/cm2 at 100°C, the hot-spot temperature is 132.2°C which surpasses the average Cu column temperature of 129.7 °C and the average solder bump temperature of 127.4 °C. It is interesting that there are two modes of temperature distribution in the Cu column and in the solder bump, respectively.

AB - In this study, the temperature map distribution in the Sn3.0Ag0.5Cu solder bump with Cu column under current stressing is directly examined using infrared microscopy. It is the radiance changes between the different materials of the surface that cause the unreasonable temperature map distribution. By coating a thin layer of black optical paint which is in order to eliminate the radiance changes, we got the corrected temperature map distribution. Under a current stress of 1.15 × 104 A/cm2 at 100°C, the hot-spot temperature is 132.2°C which surpasses the average Cu column temperature of 129.7 °C and the average solder bump temperature of 127.4 °C. It is interesting that there are two modes of temperature distribution in the Cu column and in the solder bump, respectively.

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T3 - IMPACT Conference 2009 International 3D IC Conference - Proceedings

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BT - IMPACT Conference 2009 International 3D IC Conference - Proceedings

Y2 - 21 October 2009 through 23 October 2009

ER -

Direct measurement of hot-spot temperature in flip-chip solder joints with Cu columns under current stressing using infrared microscopy

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