Direct measurement of hot-spot temperature in flip-chip solder joints with Cu columns under current stressing using infrared microscopy

You Chun Liang, Chih Chen*

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Scopus citations

Abstract

In this study, the temperature map distribution in the Sn3.0Ag0.5Cu solder bump with Cu column under current stressing is directly examined using infrared microscopy. It is the radiance changes between the different materials of the surface that cause the unreasonable temperature map distribution. By coating a thin layer of black optical paint which is in order to eliminate the radiance changes, we got the corrected temperature map distribution. Under a current stress of 1.15 × 104 A/cm2 at 100°C, the hot-spot temperature is 132.2°C which surpasses the average Cu column temperature of 129.7 °C and the average solder bump temperature of 127.4 °C. It is interesting that there are two modes of temperature distribution in the Cu column and in the solder bump, respectively.

Original languageEnglish
Title of host publicationIMPACT Conference 2009 International 3D IC Conference - Proceedings
Pages158-161
Number of pages4
DOIs
StatePublished - 1 Dec 2009
EventIMPACT Conference 2009 International 3D IC Conference - Taipei, Taiwan
Duration: 21 Oct 200923 Oct 2009

Publication series

NameIMPACT Conference 2009 International 3D IC Conference - Proceedings

Conference

ConferenceIMPACT Conference 2009 International 3D IC Conference
CountryTaiwan
CityTaipei
Period21/10/0923/10/09

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    Liang, Y. C., & Chen, C. (2009). Direct measurement of hot-spot temperature in flip-chip solder joints with Cu columns under current stressing using infrared microscopy. In IMPACT Conference 2009 International 3D IC Conference - Proceedings (pp. 158-161). [5382153] (IMPACT Conference 2009 International 3D IC Conference - Proceedings). https://doi.org/10.1109/IMPACT.2009.5382153