Direct measurement of hot-spot temperature in flip-chip solder joints with Cu columns under current stressing using infrared microscopy

Yu Chun Liang*, Chih Chen, D. J. Yao

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In this study, the temperature map distribution in the Sn3.0Ag0.5Cu solder bump with Cu column under current stressing is directly examined using infrared microscopy. It is the radiance changes between the different materials of the surface that cause the unreasonable temperature map distribution. By coating a thin layer of black optical paint which is in order to eliminate the radiance changes, we got the corrected temperature map distribution. Under a current stress of 1.15 × 104 A/cm2 at 100 °C, the hot-spot temperature is 132.2°C which surpasses the average Cu column temperature of 129.7°C and the average solder bump temperature of 127.4 °C. Thermomigration in solder may still occur under a large current stressing.

Original languageEnglish
Title of host publicationAdvanced Interconnects and Chemical Mechanical Planarization for Micro- and Nanoelectronics
Pages259-264
Number of pages6
DOIs
StatePublished - 24 Dec 2010
Event2010 MRS Spring Meeting - San Francisco, CA, United States
Duration: 5 Apr 20109 Apr 2010

Publication series

NameMaterials Research Society Symposium Proceedings
Volume1249
ISSN (Print)0272-9172

Conference

Conference2010 MRS Spring Meeting
CountryUnited States
CitySan Francisco, CA
Period5/04/109/04/10

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