Direct evidence of Cu/cap/liner edge being the dominant electromigration path in dual damascene Cu interconnects

W. Shao*, S. G. Mhaisalkar, T. Sritharan, A. V. Vairagar, H. J. Engelmann, O. Aubel, E. Zschech, A. M. Gusak, King-Ning Tu

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

20 Scopus citations

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Physics & Astronomy