@inproceedings{e785cb275cf24ec996d096ecc99e6c43,
title = "Diffusion behavior and mechanism of co-sputtering metals as bonding materials for 3D IC interconnects during annealing treatment",
abstract = "A diffusion behavior was observed for co-sputtered metals during thermal treatment, while these metals were fabricated as bonding mediums in 3D IC applications. This paper reports and discusses the mechanical behavior of co-sputtering metals before and after annealing. In addition, co-sputtering metal bonding seems to be an option for bonding technology based on their excellent bonding results.",
keywords = "3DIC, bonding, co-sputtering, diffusion",
author = "Hsu, {S. Y.} and Shih, {J. Y.} and Kuan-Neng Chen",
year = "2011",
month = sep,
day = "26",
doi = "10.1109/INEC.2011.5991631",
language = "English",
isbn = "9781457703799",
series = "Proceedings - International NanoElectronics Conference, INEC",
booktitle = "4th IEEE International NanoElectronics Conference, INEC 2011",
note = "null ; Conference date: 21-06-2011 Through 24-06-2011",
}