Dielectric property and microstructure of a porous polymer material with ultralow dielectric constant

Yuhuan Xu*, Yi Pin Tsai, King-Ning Tu, Bin Zhao, Q. Z. Liu, Maureen Brongo, George T.T. Sheng, C. H. Tung

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

77 Scopus citations

Abstract

This letter reports the synthesis and dielectric properties of a porous poly(arylethers) material with an ultralow dielectric constant for interlayer dielectric applications in microelectronics. The porous polymer films were fabricated by a method of organic phase separation and evaporation. A dielectric constant of 1.8 was achieved for a porous film with an estimated porosity of 40%. The characterization of microstucture for the porous film showed numerous nanopores with an average size of 3 nm distributed uniformly throughout the film.

Original languageEnglish
Pages (from-to)853-855
Number of pages3
JournalApplied Physics Letters
Volume75
Issue number6
DOIs
StatePublished - 9 Aug 1999

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