Device challenges and opportunities

Chen-Ming Hu*

*Corresponding author for this work

Research output: Contribution to journalConference article

55 Scopus citations

Abstract

CMOS technology is facing exciting opportunities and formidable challenges. They include mobility scaling to overcome the speed/power barrier, new gate-stack materials and/or new device structures to overcome the gate-length/leakage barrier, nonvolatile memory and universal memory to enlarge the market, and containment of costs. CMOS has much more to give in the next two decades, yet it is not too early, especially in universities, to start searching for not-CMOS-like circuit/system architectures that may require non-existing new devices but offer the promise of dramatic reduction in power and cost.

Original languageEnglish
Pages (from-to)4-5
Number of pages2
JournalDigest of Technical Papers - Symposium on VLSI Technology
DOIs
StatePublished - 1 Oct 2004
Event2004 Symposium on VLSI Technology - Digest of Technical Papers - Honolulu, HI, United States
Duration: 15 Jun 200417 Jun 2004

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