Development of lead-free solders in China during the past decade

Liang Zhang*, King-Ning Tu, Sinnwen Chen, Hui Fan, Xiangning Lu, Xiaowu Hu, Sujuan Zhong, Fan Yang

*Corresponding author for this work

Research output: Contribution to journalReview articlepeer-review

8 Scopus citations


For the new lead-free solders research in China during the past decade, the research status and development trend of lead-free solders were reviewed synthetically. First of all, it is imperative to discuss the behaviors of different lead-free solder, and the effect of alloying, particles strength and nanominiaturization on lead-free solders. Secondly, the fluxes for lead-free solders were also reviewed and the research development of new flux was discussed. Thirdly, the applications of lead-free solders in electronic industry were remarked, and the related reliability issues were discussed. Lastly the future progress of lead-free solders was prospected, the issues of the lead-free solders were analyzed and some measures were shown for solving these problems, which can provide the theoretical reference for the lead-free solders.

Original languageEnglish
Pages (from-to)767-790
Number of pages24
JournalZhongguo Kexue Jishu Kexue/Scientia Sinica Technologica
Issue number8
StatePublished - 1 Aug 2016


  • Alloying
  • Lead-free solder
  • Nanominiaturization
  • Particle strength
  • Reliability

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