Development of an internet of civil infrastructure framework

Der-Cherng Liaw, Tzu Hsuan Lin

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Scopus citations

Abstract

Nowadays, the civil infrastructures are subjected to disasters such as fires, floods, and earthquakes. Recently, the novel concept of Internet of Things (IoT) is known to be useful for managing crisis situations via providing a good disaster management and emergency response information. This paper addresses the civil infrastructure issue of health monitoring and disaster management by introducing IoT technology. A concept of internet of civil infrastructure (IoCI) framework is also proposed in this paper. The proposed framework is a three layered architecture. Among them, the top layer is a wireless sensor network (WSN) client which is deployed in civil infrastructure to perform specific tasks such as sensing, data processing, and acknowledgement. The middle layer is an information exchange web service (IEWS) through which all the information such as sensor data, structural health and location are exchanged, while the remaining layer is a mobile device based information platform for data representation, control, and event notification.

Original languageEnglish
Title of host publicationAdvances in Applied Materials and Electronics Engineering II
Pages583-587
Number of pages5
DOIs
StatePublished - 3 Jun 2013
Event2nd International Conference on Applied Materials and Electronics Engineering, AMEE 2013 - Hong Kong, China
Duration: 19 Apr 201320 Apr 2013

Publication series

NameAdvanced Materials Research
Volume684
ISSN (Print)1022-6680

Conference

Conference2nd International Conference on Applied Materials and Electronics Engineering, AMEE 2013
CountryChina
CityHong Kong
Period19/04/1320/04/13

Keywords

  • Disaster management
  • Internet of things
  • Web service
  • Wireless sensor networks

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  • Cite this

    Liaw, D-C., & Lin, T. H. (2013). Development of an internet of civil infrastructure framework. In Advances in Applied Materials and Electronics Engineering II (pp. 583-587). (Advanced Materials Research; Vol. 684). https://doi.org/10.4028/www.scientific.net/AMR.684.583