@inproceedings{98452fe23d3b46b49e004aca5bbdceec,
title = "Development and investigation of ultra-thin buffer layers used in symmetric Cu/Sn bonding and asymmetric Cu/Sn-Cu bonding for advanced 3D integration applications",
abstract = "In this work, a particular ultra-thin buffer layer (UBL) with various thickness ranging from 10 nm to 100 nm and different materials including Co, Ni, Pd and Ti is inserted between Cu/Sn to delay the interdiffusion prior to eutectic bonding. The efficacy of the buffer layer and the bonding quality are systematically conferred using microstructure imaging, material analysis, and electrical performance. In addition to symmetric Cu/Sn bonding with UBL, an asymmetric Cu/Sn-Cu bonding which is proposed to relieve the heat-enhanced interdiffusion issues thereby enhancing the reliability performance is demonstrated with the assistance of UBL technology.",
author = "Chen, {Hsiu Chi} and Kho, {Yi Tung} and Huang, {Yen Jun} and Hsieh, {Yu Sheng} and Chang, {Yao Jen} and Tang, {Ya Sheng} and Yu, {Ting Yang} and Kuan-Neng Chen",
year = "2018",
month = jan,
day = "12",
doi = "10.1109/IMPACT.2017.8255924",
language = "English",
series = "Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT",
publisher = "IEEE Computer Society",
pages = "85--88",
booktitle = "IMPACT 2017 - 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Proceedings",
address = "United States",
note = "null ; Conference date: 25-10-2017 Through 27-10-2017",
}